JPH0215316Y2 - - Google Patents
Info
- Publication number
- JPH0215316Y2 JPH0215316Y2 JP10081684U JP10081684U JPH0215316Y2 JP H0215316 Y2 JPH0215316 Y2 JP H0215316Y2 JP 10081684 U JP10081684 U JP 10081684U JP 10081684 U JP10081684 U JP 10081684U JP H0215316 Y2 JPH0215316 Y2 JP H0215316Y2
- Authority
- JP
- Japan
- Prior art keywords
- electrolytic capacitor
- case
- sealing body
- opening
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000003990 capacitor Substances 0.000 claims description 22
- 238000007789 sealing Methods 0.000 claims description 6
- 229920003002 synthetic resin Polymers 0.000 claims description 4
- 239000000057 synthetic resin Substances 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 2
- 238000005476 soldering Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 239000006071 cream Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000004506 ultrasonic cleaning Methods 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10081684U JPS6115725U (ja) | 1984-07-02 | 1984-07-02 | 電解コンデンサ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10081684U JPS6115725U (ja) | 1984-07-02 | 1984-07-02 | 電解コンデンサ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6115725U JPS6115725U (ja) | 1986-01-29 |
| JPH0215316Y2 true JPH0215316Y2 (en]) | 1990-04-25 |
Family
ID=30660259
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10081684U Granted JPS6115725U (ja) | 1984-07-02 | 1984-07-02 | 電解コンデンサ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6115725U (en]) |
-
1984
- 1984-07-02 JP JP10081684U patent/JPS6115725U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6115725U (ja) | 1986-01-29 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS6011538Y2 (ja) | チツプ型ヒユ−ズ | |
| JPH0215316Y2 (en]) | ||
| JPH0214193Y2 (en]) | ||
| JPH0416421Y2 (en]) | ||
| JPH0214194Y2 (en]) | ||
| JPS607473Y2 (ja) | 固体電解コンデンサ | |
| JPH0416423Y2 (en]) | ||
| JPS5812470Y2 (ja) | プリント配線基板 | |
| JPS6217990Y2 (en]) | ||
| JPH0349397Y2 (en]) | ||
| JPS6240439Y2 (en]) | ||
| JPH0316274Y2 (en]) | ||
| JPS5883101U (ja) | 電子部品の実装構造 | |
| JPH04237155A (ja) | 電子部品 | |
| JPS6089966U (ja) | ハンダ槽 | |
| JPH0533572U (ja) | 印刷回路 | |
| JPS59114888A (ja) | 電子部品の端子構造 | |
| JPH0410362U (en]) | ||
| JPS59125880U (ja) | 接続装置 | |
| JPH0436275U (en]) | ||
| JPH0543283B2 (en]) | ||
| JPH0418473U (en]) | ||
| JPS62178521U (en]) | ||
| JPS58178584A (ja) | フレキシブル印刷配線基板 | |
| JPH02241084A (ja) | 電子部品装着方法 |